Welcome!

Java IoT Authors: Elizabeth White, Jyoti Bansal, Dana Gardner, Liz McMillan, Yeshim Deniz

News Feed Item

UBM Tech Announces the 2012 EDN Hot 100, Showcases the Electronics Industry's Most Significant Products of the Year

SAN FRANCISCO, Nov. 19, 2012 /PRNewswire/ -- UBM Tech, the global leader in technology media and business information, today announced the 2012 EDN Hot 100, the electronics industry's most significant products of the year based on innovation, significance, usefulness, and popularity. The technologies range from ICs and components, to software, test instruments, development tools, and sensors. EDN is the comprehensive information resource for the electronics original equipment manufacturer segment, providing in-depth technical information for electronics design engineers and news and strategic business insight for executives.

(Logo: http://photos.prnewswire.com/prnh/20121119/SF15983LOGO)

"It's always a fun and enlightening challenge for the EDN editors to select the year's Hot 100 products, which has been an annual tradition at EDN since 1993. This year's selection not only reflects some technology trends that have been in place for a while, but also highlights some new trends that are just emerging, as well as a unique product or two that is in a class of its own," said Rich Pell, Executive and Chief Technical Editor, EDN.

Key industry trends include:

  • An ongoing emphasis on low power and power-efficient solutions, reflecting the ever-growing use of mobile products and power conservation concerns
  • The same for wireless communications - whether Wi-Fi, cellular, GPS, ZigBee, or something else, more and more end products are becoming connected as we move toward the "Internet of Things"
  • An increasing emphasis on security in all areas - mobile, automotive, smart meter - reflecting the increasing move toward "smart" connected products in virtually all industries and applications
  • Health and fitness-targeted devices are on the rise, reflecting a trend toward tech-enabled personal health products - both mobile and in the home
  • Some of the predictions made by Nikola Tesla a century ago about wireless power are finally becoming reality, as we are seeing more devices aimed at allowing end products to be powered or charged without needing wires or cables

The EDN Hot 100 award winners include:

Analog

Freescale Semiconductor - MC33813 and MC33814 electronic engine control Ics

Texas Instruments - LMH6881 and LMH6882 programmable differential amplifiers

Analog Devices  - AD8237 zero-drift precision instrumentation amplifier

Texas Instruments - AFE4300 weigh scale and body composition AFE

Analog Devices - AD8232 heart-rate monitor AFE

Maxim Integrated Products - Analog/mixed-signal peripheral modules for FPGAs

Maxim Integrated Products - Zeus smart meter SoC

NXP Semiconductors - TFA9887 3.7W audio system

Touchstone Semiconductor - TS12011 and TS12012 op amp/comparator/reference combo ICs

Microchip Technology - MCP47A1 DAC

Linear Technology - LTC4366 floating surge stopper IC

Boards & Development Tools

Gumstix - Waysmall Silverlode computer

Via Technologies - Android PC

Kontron - KTT30/mITX Mini-ITX motherboard

ADLINK Technology - CoreModule 720 PC/104-Plus SBC

Microchip Technology - RN-131 and RN-171 PICtail/PICtail Plus Wi-Fi development boards

Terasic - TR5-Lite, DE5-NET, and TR5-F40W FPGA development boards

Texas Instruments - TMDSEVM6657L and TMDSEVM6657LE TMS320C665x DSP evaluation modules

Energy Micro - EFM32-GGSTK3700 and EFM32LG-STK3600 EFM32 starter kits

STMicroelectronics - STM3220G-JAVA Starter Kit

Texas Instruments - Stellaris LM4F120 LaunchPad evaluation kit

Microchip Technology - MPLAB XC C compilers

Communications and Networking

Linear Technology - SmartMesh LTC5800 SoC and LTP5900 module families

B&B Electronics - SPECTRE 3G cellular router

Broadcom - XLP 200-Series multicore communications processors

Texas Instruments - Thunderbolt interface support chipset family

Components

Ioxus - iCAP 3,000 Farad ultracapacitor

Murata Electronics - LXWS series wireless power transmission module

STMicroelectronics - SuperMESH 5 power MOSFETs

Servoflo Corporation - MP-6 Series micropumps

Clare - CPC1540 optically isolated solid state relay

ROHM Semiconductor - SCH2080KE SiC Power MOSFET

Cellergy - CLC series supercapacitors

AEM Components - AirMatrix 2410 surface-mount electronic fuses

Vishay Intertechnology - Draloric VSGR 20kW power resistor

EDA/IP

Xilinx - Vivado Design Suite

Digital Core Design - DoCD debugging system

ARM - ARM Development Studio 5 Community Edition (CE)

Apache Design - RTL Power Model

Triad Semiconductor - ViaDesigner

Memory and Storage

Netlist - HyperCloud HCDIMM

Microchip Technology - 23A1024/23LC1024, 23A512/23LC512, 23LCV51/23LCV1024 serial SRAM family

Kingston Digital - DataTraveler HyperX 3.0 USB Flash drive

Toshiba America Electronic Components - TransMemory-EX TM series USB flash memory products

Micron Technology - DDR4 DRAM module

Microcontrollers and Processors

Atmel - ATF697FF rad-hard microprocessor

Digital Core Design - DQ80251 80C51 CPU

Freescale Semiconductor - Kinetis K70 microcontrollers

Infineon Technologies - AUDO MAX Secure Hardware Extension 32-bit microcontrollers

Microchip Technology - MGC3130 electrical-field-based 3D gesture controller

MIPS Technologies - proAptiv, interAptiv and microAptiv microprocessor cores

STMicroelectronics - STM32 F3 series microcontrollers

Texas Instruments - C2000 Piccolo TMS320F2802x microcontrollers

ams - AS3421 and AS3422 single-chip ANC solutions

Optoelectronics and Lighting Control

Linear Technology - LT3763 synchronous buck LED driver controller

Texas Instruments - LM3463 six-channel LED driver

STMicroelectronics - LBP01 bypass protection switch

Cree - XLamp XP-E2 LED

iWatt - iW3616 and iW3617 LED drivers

XIMEA - MQ series industrial machine vision cameras

Vishay Intertechnology - VLMx1500-GS08 series ultra-bright LEDs

Vishay Intertechnology - VSMY7852X01 and VSMY7850X01 IR emitters

California Eastern Laboratories - NV4V31MF blue-violet laser diode

Power

Vicor - Picor PI33XX Cool-Power ZVS buck regulators

TDK-Lambda - HWS-L/BAT series power supplies

Ultra Volt - PXS Series ultra-small high-voltage power supplies

Texas Instruments - TPS81256 boost converter module

Outback Power - Radian Series GS7048E Inverter/Charger

International Rectifier - Ultrabook Vcore power management solutions

Linear Technology - LT3504 quad step-down DC/DC converter

ON Semiconductor - NCP1851 Li-Ion switching battery charger

CUI - NDM2P POL modules

Renesas Electronics - NFC wireless charging system

Power Integrations - LinkSwitch-HP off-line switcher ICs

Programmable Logic

Lattice Semiconductor - LatticeECP4 FPGAs

Microsemi - SmartFusion2 SoC FPGA

Altera - Arria V GZ FPGAs

Xilinx - H580T heterogeneous 3D FPGA

RF/Microwave

Silicon Labs - Si477x AM/FM receivers

Microchip Technology - PIC12LF1840T48A MCU/RF transmitter

Epiq Solutions - Matchstiq SDR

Linear Technology - LTC5585 I/Q demodulator

NXP Semiconductors - BGU700x GPS LNAs

Stonestreet One - Bluetooth Smart module

Telit Wireless Solutions - Jupiter SE880 GPS receiver module

Sensors

ams - AS3935 Franklin Lightning Sensor IC

Analog Devices - ADMP504 MEMS microphone

Semtech Corporation - SX9300 capacitive proximity sensor

Freescale Semiconductor - Xtrinsic FXOS8700CQ six-axis sensor

STMicroelectronics - LSM303D e-compass module

Sensirion - SHTC1 humidity and temperature sensor

Test & Measurement

National Instruments - PXIe-5644R RF vector signal transceiver

Rohde & Schwarz - Model ESR EMI Test Receiver

Teledyne LeCroy - HDO oscilloscope family

Keithley Instruments - Model 2657A high-voltage, high-power SMU

Bloomy Controls - Headless ATE system

Oscium - LogiScope logic analyzer for iPad/iPhone

Rigol Technologies - DS4000 series digital oscilloscope

Tektronix - THS3000 series of handheld oscilloscopes

Agilent Technologies - 1000B Series oscilloscopes

The complete list of EDN's Hot 100 products can be found online at http://www.edn.com/electronics-products/other/4401457/EDN-Hot-100-products-of-2012 or within the December 14, 2012 issue of EDN Magazine.

For more detailed information, companies with EDN Hot 100 products should contact Joy Daniels, Marketing Director, Electronics at UBM Tech at [email protected] or 415.947.6314.

About UBM Tech
UBM Tech is a global media business that provides information, events, training, data services, and marketing solutions for the technology industry. Its media brands and information services inform and inspire decision makers across the entire technology market— engineers and design professionals, software and game developers, solutions providers and integrators, networking and communications executives, and business technology professionals. UBM Tech's industry-leading media brands include EE Times, Interop, Black Hat, InformationWeek, Game Developer Conference, CRN, and DesignCon. The company's information products include research, education, training, and data services that accelerate decision making for technology buyers.  UBM Tech also offers a full range of marketing services based on its content and technology market expertise, including custom events, content marketing solutions, community development and demand generation programs. UBM Tech is a part of UBM (UBM.L), a global provider of media and information services with a market capitalization of more than $2.5 billion.

For more information on UBM Tech please contact:
Felicia Hamerman, Vice President, Marketing
T: 516.562.5652, E: [email protected]

SOURCE UBM Tech

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
SYS-CON Events announced today that Ocean9will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Ocean9 provides cloud services for Backup, Disaster Recovery (DRaaS) and instant Innovation, and redefines enterprise infrastructure with its cloud native subscription offerings for mission critical SAP workloads.
The taxi industry never saw Uber coming. Startups are a threat to incumbents like never before, and a major enabler for startups is that they are instantly “cloud ready.” If innovation moves at the pace of IT, then your company is in trouble. Why? Because your data center will not keep up with frenetic pace AWS, Microsoft and Google are rolling out new capabilities In his session at 20th Cloud Expo, Don Browning, VP of Cloud Architecture at Turner, will posit that disruption is inevitable for c...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
SYS-CON Events announced today that Conference Guru has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. A valuable conference experience generates new contacts, sales leads, potential strategic partners and potential investors; helps gather competitive intelligence and even provides inspiration for new products and services. Conference Guru works with conference organizers to pass great dea...
SYS-CON Events announced today that Technologic Systems Inc., an embedded systems solutions company, will exhibit at SYS-CON's @ThingsExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Technologic Systems is an embedded systems company with headquarters in Fountain Hills, Arizona. They have been in business for 32 years, helping more than 8,000 OEM customers and building over a hundred COTS products that have never been discontinued. Technologic Systems’ pr...
SYS-CON Events announced today that CA Technologies has been named “Platinum Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CA Technologies helps customers succeed in a future where every business – from apparel to energy – is being rewritten by software. From ...
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend @CloudExpo | @ThingsExpo, June 6-8, 2017, at the Javits Center in New York City, NY and October 31 - November 2, 2017, Santa Clara Convention Center, CA. Learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.
SYS-CON Events announced today that Telecom Reseller has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. Telecom Reseller reports on Unified Communications, UCaaS, BPaaS for enterprise and SMBs. They report extensively on both customer premises based solutions such as IP-PBX as well as cloud based and hosted platforms.
SYS-CON Events announced today that Loom Systems will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 2015, Loom Systems delivers an advanced AI solution to predict and prevent problems in the digital business. Loom stands alone in the industry as an AI analysis platform requiring no prior math knowledge from operators, leveraging the existing staff to succeed in the digital era. With offices in S...
SYS-CON Events announced today that Interoute, owner-operator of one of Europe's largest networks and a global cloud services platform, has been named “Bronze Sponsor” of SYS-CON's 20th Cloud Expo, which will take place on June 6-8, 2017 at the Javits Center in New York, New York. Interoute is the owner-operator of one of Europe's largest networks and a global cloud services platform which encompasses 12 data centers, 14 virtual data centers and 31 colocation centers, with connections to 195 add...
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
In his session at @ThingsExpo, Eric Lachapelle, CEO of the Professional Evaluation and Certification Board (PECB), will provide an overview of various initiatives to certifiy the security of connected devices and future trends in ensuring public trust of IoT. Eric Lachapelle is the Chief Executive Officer of the Professional Evaluation and Certification Board (PECB), an international certification body. His role is to help companies and individuals to achieve professional, accredited and worldw...
SYS-CON Events announced today that Infranics will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Since 2000, Infranics has developed SysMaster Suite, which is required for the stable and efficient management of ICT infrastructure. The ICT management solution developed and provided by Infranics continues to add intelligence to the ICT infrastructure through the IMC (Infra Management Cycle) based on mathemat...
SYS-CON Events announced today that SD Times | BZ Media has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. BZ Media LLC is a high-tech media company that produces technical conferences and expositions, and publishes a magazine, newsletters and websites in the software development, SharePoint, mobile development and commercial UAV markets.
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
Now that the world has connected “things,” we need to build these devices as truly intelligent in order to create instantaneous and precise results. This means you have to do as much of the processing at the point of entry as you can: at the edge. The killer use cases for IoT are becoming manifest through AI engines on edge devices. An autonomous car has this dual edge/cloud analytics model, producing precise, real-time results. In his session at @ThingsExpo, John Crupi, Vice President and Eng...
SYS-CON Events announced today that HTBase will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. HTBase (Gartner 2016 Cool Vendor) delivers a Composable IT infrastructure solution architected for agility and increased efficiency. It turns compute, storage, and fabric into fluid pools of resources that are easily composed and re-composed to meet each application’s needs. With HTBase, companies can quickly prov...
There are 66 million network cameras capturing terabytes of data. How did factories in Japan improve physical security at the facilities and improve employee productivity? Edge Computing reduces possible kilobytes of data collected per second to only a few kilobytes of data transmitted to the public cloud every day. Data is aggregated and analyzed close to sensors so only intelligent results need to be transmitted to the cloud. Non-essential data is recycled to optimize storage.
"I think that everyone recognizes that for IoT to really realize its full potential and value that it is about creating ecosystems and marketplaces and that no single vendor is able to support what is required," explained Esmeralda Swartz, VP, Marketing Enterprise and Cloud at Ericsson, in this SYS-CON.tv interview at @ThingsExpo, held June 7-9, 2016, at the Javits Center in New York City, NY.
SYS-CON Events announced today that IoT Now has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. IoT Now explores the evolving opportunities and challenges facing CSPs, and it passes on some lessons learned from those who have taken the first steps in next-gen IoT services.